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 DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
DESCRIPTION
The MOCD223-M consist of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor darlington detectors, in a surface mountable, small outline plastic package. It is ideally suited for high density applications that require low input current and eliminates the need for through-the-board mounting.
FEATURES
* U.L. Recognized (File #E90700, Volume 2) * VDE Recognized (File #13616) (add option "V" for VDE approval, i.e, MOCD223V-M) * Convenient Plastic SOIC-8 Surface Mountable Package Style * High Current Transfer Ratio of 500% Minimum at IF = 1 mA * Minimum BVCEO of 30 Volts Guaranteed * Standard SOIC-8 Footprint, with 0.050" Lead Spacing * Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering * High Input-Output Isolation Voltage of 2500 VAC(rms) Guaranteed
LED 1 ANODE 1
8 COLLECTOR 1
LED 1 CATHODE 2
7 EMITTER 1
LED 2 ANODE 3
6 COLLECTOR 2
LED 2 CATHODE 4
5 EMITTER 2
APPLICATIONS
* Interfacing and coupling systems of different potentials and impedances * General purpose switching circuits * Monitor and detection circuits
ABSOLUTE MAXIMUM RATINGS (TA = 25C Unless otherwise specified)
Rating EMITTER Forward Current - Continuous Forward Current - Peak (PW = 100 s, 120 pps) Reverse Voltage LED Power Dissipation @ TA = 25C Derate above 25C DETECTOR Collector-Emitter Voltage Collector-Base Voltage Emitter-Collector Voltage Collector Current-Continuous Detector Power Dissipation @ TA = 25C Derate above 25C TOTAL DEVICE Input-Output Isolation Voltage(1,2,3) (f = 60 Hz, t = 1 min. Duration) Total Device Power Dissipation @ TA = 25C Derate above 25C Ambient Operating Temperature Range Storage Temperature Range Lead Soldering Temperature (1/16" from case, 10 sec. duration) Symbol IF IF (pk) VR PD Value 60 1.0 6.0 90 0.8 30 70 7.0 150 150 1.76 Unit mA A V mW mW/C V V V mA mW mW/C
VCEO VCBO VECO IC PD
VISO PD TA Tstg TL
2500 250 2.94 -40 to +100 -40 to +150 260
Vac(rms) mW mW/C C C C
(c) 2003 Fairchild Semiconductor Corporation
Page 1 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified)
Parameter EMITTER Input Forward Voltage Reverse Leakage Current Capacitance DETECTOR Collector-Emitter Dark Current Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Capacitance COUPLED Collector-Output Current(4) Collector-Emitter Saturation Voltage Turn-On Time Turn-Off Time Rise Time Fall Time Isolation Surge Voltage(1,2,3) Isolation Resistance(2) Isolation Capacitance(2) ** Typical values at TA = 25C NOTE: 1. Isolation Surge Voltage, VISO, is an internal device dielectric breakdown rating. 2. For this test, Pins 1, 2, 3 and 4 are common and Pins 5, 6, 7 and 8 are common. 3. VISO rating of 2500 VAC(rms) for t = 1 min. is equivalent to a rating of 3,000 VAC(rms) for t = 1 sec. 4. Current Transfer Ratio (CTR) = IC/IF x 100%. (IF = 1.0 mA, VCE = 5 V) (IC = 500 A, IF = 1.0 mA) (IF = 5.0 mA, VCC = 10 V, RL = 100 )(fig 6.) (IF = 5.0 mA, VCC = 10 V, RL = 100 )(fig 6.) (IF = 5.0 mA, VCC = 10 V, RL = 100 )(fig 6.) (IF = 5.0 mA, VCC = 10 V, RL = 100 )(fig 6.) f = 60 Hz, t = 1 min. VI-O = 500 V VI-O = 0 V, f = 1 MHz CTR VCE (sat) ton toff tr tf VISO RISO CISO 500 -- -- -- -- -- 2500 1011 -- 1000 -- 3.5 95 1.0 2.0 -- -- 0.2 -- 1.0 -- -- -- -- -- -- -- % V s s s s Vac(rms) pF (VCE = 5.0 V, TA = 25C) (VCE = 5.0 V, TA = 100C) (IC = 100 A) (IE = 100 A) (f =z 1.0 MHz, VCE = 0) ICEO1 ICEO2 BVCEO BVECO CCE -- -- 30 7.0 -- 1.0 1.0 90 10 5.5 50 -- -- -- -- nA A V V pF (IF = 1.0 mA) (VR = 6.0 V) VF IR CIN -- -- -- 1.25 0.001 18 1.3 100 -- V A pF Test Conditions Symbol Min Typ** Max Unit
(c) 2003 Fairchild Semiconductor Corporation
Page 2 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
Fig. 1 LED Forward Voltage vs. Forward Current
1.8 10
Fig. 2 Output Curent vs. Input Current
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
1.7
VF - FORWARD VOLTAGE (V)
1.6
1.5
1.4 TA = 55C 1.3 TA = 25C
1
1.2
1.1
TA = 100C
1.0 1 10 100
IF - LED FORWARD CURRENT (mA)
VCE = 5V NORMALIZED TO I F = 1mA 0.1 0.1 1 10 100
Fig. 3 Output Current vs. Ambient Temperature
10
IF - LED INPUT CURRENT (mA)
Fig. 4 Output Current vs. Collector - Emitter Voltage
2.0
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
I C - OUTPUT COLLECTOR CURRENT (NORMALIZED)
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 6
1
0.1
0.01 -80 -60 -40 -20 0 20
IF = 1mA, VCE = 5V NORMALIZED TO TA = 25oC 40 60
o
80
100
120
IF = 1mA NORMALIZED TO VCE = 5V 7 8 9 10
TA - AMBIENT TEMPERATURE ( C)
VCE - COLLECTOR -EMITTER VOLTAGE (V)
Fig. 5 Dark Current vs. Ambient Temperature
10 5
I CEO - COLLECTOR -EMITTER DARK CURRENT (nA)
10 4 VCE = 10V NORMALIZED TO TA= 25 oC
10 3
10 2
10 1
10 0
10 -1
10 -2 0 20 40 60
o
80
100
TA - AMBIENT TEMPERATURE ( C)
(c) 2003 Fairchild Semiconductor Corporation
Page 3 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
TEST CIRCUIT
VCC = 10V
INPUT PULSE
WAVE FORMS
IF INPUT RBE
IC
RL
10% 90% tr ton tf toff OUTPUT PULSE
OUTPUT
Figure 6. Switching Time Test Circuit and Waveforms
(c) 2003 Fairchild Semiconductor Corporation
Page 4 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
Package Dimensions (Surface Mount) 8-Pin Small Outline
0.024 (0.61)
0.164 (4.16) 0.144 (3.66)
SEATING PLANE
0.060 (1.52)
PIN1 0.202 (5.13) 0.182 (4.63)
0.275 (6.99) 0.155 (3.94)
0.010 (0.25) 0.006 (0.16)
0.143 (3.63) 0.123 (3.13)
0.021 (0.53) 0.011 (0.28)
0.008 (0.20) 0.003 (0.08) 0.050 (1.27) TYP
0.244 (6.19) 0.224 (5.69)
0.050 (1.27)
Lead Coplanarity : 0.004 (0.10) MAX
(c) 2003 Fairchild Semiconductor Corporation
Page 5 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
ORDERING INFORMATION
Option V R1 R1V R2 R2V Order Entry Identifier V R1 R1V R2 R2V Description VDE 0884 Tape and reel (500 units per reel) VDE 0884, Tape and reel (500 units per reel) Tape and reel (2500 units per reel) VDE 0884, Tape and reel (2500 units per reel)
MARKING INFORMATION
1
D223 V X YY S
2
6
3
4
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code
(c) 2003 Fairchild Semiconductor Corporation
Page 6 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
QT Carrier Tape Specifications
8.0 0.10 3.50 0.20 0.30 MAX 4.0 0.10 2.0 0.05 O1.5 MIN 1.75 0.10
5.5 0.05 8.3 0.10 12.0 0.3 5.20 0.20
0.1 MAX
6.40 0.20
O1.5 0.1/-0
User Direction of Feed
Reflow Profile
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak
230C, 10-30 s
Time above 183C, 120-180 sec Ramp up = 2-10C/sec * Peak reflow temperature: 245C (package surface temperature) * Time of temperature higher than 183C for 120-180 seconds * One time soldering reflow is recommended 3.5 4 4.5
3
Time (Minute)
(c) 2003 Fairchild Semiconductor Corporation
Page 7 of 8
4/10/03
DUAL CHANNEL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLERS MOCD223-M
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
Page 8 of 8
4/10/03


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